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High melting point alloy compatible type "B280P3202J"
High Melting Point Alloy Compatible B280P3202J This is a solder paste of the high melting point type. It is ideal for mounting components with high heat generation, such as power semiconductors. The viscosity is adjusted to match the high density of high-temperature solder, allowing for stable application.
High-intensity solder for laser applications type BH63G3228G-HR
This is a solder paste that uses high-strength solder alloy. It is suitable for mounting in areas where reliability is required, such as automotive electronic components. It uses a special activator that enables rapid heating implementation with light. This reduces slumping during heating and resolves issues with solder balls.
Residue Flow Prevention Type BH63E3021F
Using a flux with high melting viscosity, it is compatible with rapid heating implementation by light. It suppresses the flow out of the flux during heating, resulting in a good appearance after implementation.
Laser Dispense Type BH63J3229G
Using a special activator that enables rapid heating implementation with light. It reduces sagging during heating and solves issues with solder balls.
